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NTF5P03, NVF5P03
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
Negative sign for P ? Channel devices omitted for clarity
Drain ? to ? Source Voltage
Drain ? to ? Gate Voltage (R GS = 1.0 M W )
Gate ? to ? Source Voltage ? Continuous
Rating
Symbol
V DSS
V DGR
V GS
Max
? 30
? 30
± 20
Unit
V
V
V
1 sq in
FR ? 4 or G ? 10 PCB
10 seconds
Minimum
FR ? 4 or G ? 10 PCB
10 seconds
Thermal Resistance ? Junction to Ambient
Total Power Dissipation @ T A = 25 ° C
Linear Derating Factor
Drain Current ? Continuous @ T A = 25 ° C
Continuous @ T A = 70 ° C
Pulsed Drain Current (Note 1)
Thermal Resistance ? Junction to Ambient
Total Power Dissipation @ T A = 25 ° C
Linear Derating Factor
Drain Current ? Continuous @ T A = 25 ° C
Continuous @ T A = 70 ° C
Pulsed Drain Current (Note 1)
R THJA
P D
I D
I D
I DM
R THJA
P D
I D
I D
I DM
40
3.13
25
? 5.2
? 4.1
? 26
80
1.56
12.5
? 3.7
? 2.9
? 19
° C/W
Watts
mW/ ° C
A
A
A
° C/W
Watts
mW/ ° C
A
A
A
Operating and Storage Temperature Range
Single Pulse Drain ? to ? Source Avalanche Energy ? Starting T J = 25 ° C
(V DD = ? 30 Vdc, V GS = ? 10 Vdc, Peak I L = ? 12 Apk, L = 3.5 mH, R G = 25 W )
T J , T stg
E AS
? 55 to 150
250
° C
mJ
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Repetitive rating; pulse width limited by maximum junction temperature.
http://onsemi.com
2
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